Foundation stone of India's first advanced 3D chip packaging unit laid in Odisha

The foundation stone of India's first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar on Sunday in the presence of Odisha CM Mohan Charan Majhi and Union Minister Ashwini Vaishnaw. The facility, promoted by US-based 3D Glass Solutions with an investment of ₹1,943 crore, will serve sectors including AI, 5G/6G, defence electronics and data centres.