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India, Japan sign MoU for semiconductor manufacturing, design
short by Srishty Choudhury / on Thursday, 20 July, 2023
India and Japan signed an MoU for the development of a semiconductor ecosystem. "The MoU is on five fronts, namely, semiconductor design, manufacturing, equipment research, talent development and bringing resilience to the semiconductor supply chain," Union Minister Ashwini Vaishnaw said. "The two countries will establish an implementation organisation to decide on collaboration," he added.
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