RBM Infracon Limited jumps 17% upon signing an LOI/MoU with SUJOK GLOBAL Private Limited to develop a $1 billion semiconductor packaging facility in India. The greenfield project will focus on advanced technologies like QFN/LFBGA and hybrid bonding. RBM holds 30%, SUJOK 70%, with $600 million FDI, and completion depends on approvals and due diligence within 90 days.